By Khaled Salah,Yehea Ismail,Alaa El-Rouby

This ebook offers a wide-band and expertise autonomous, SPICE-compatible RLC version for through-silicon vias (TSVs) in 3D built-in circuits. This version debts for various results, together with epidermis impression, depletion capacitance and close by touch results. Readers will reap the benefits of in-depth insurance of suggestions and know-how akin to 3D integration, Macro modeling, dimensional research and compact modeling, in addition to closed shape equations for the via silicon through parasitics. ideas lined are proven through the use of TSVs in functions similar to a spiral inductor and inductive-based communique process and bandpass filtering.

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Khaled Salah,Yehea Ismail,Alaa El-Rouby's Arbitrary Modeling of TSVs for 3D Integrated Circuits PDF

This publication offers a wide-band and expertise self reliant, SPICE-compatible RLC version for through-silicon vias (TSVs) in 3D built-in circuits. This version money owed for numerous results, together with dermis impact, depletion capacitance and within reach touch results. Readers will make the most of in-depth insurance of recommendations and expertise similar to 3D integration, Macro modeling, dimensional research and compact modeling, in addition to closed shape equations for the via silicon through parasitics.

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